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    <title>Embedded Technology.com Newsletters</title>
    <description>Newsletters</description>
    <link>http://www.embeddedtechnology.com/</link>
    <pubDate>Wed, 18 Jan 2012 15:00:00 GMT</pubDate>
    <item>
      <title>01.18.12 -- Fingerprint And Face Biometrics For Smartphones And Mobile Devices</title>
      <description>01/18/12 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Fingerprint-And-Face-Biometrics-For-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 18 Jan 2012 15:00:00 GMT</pubDate>
    </item>
    <item>
      <title>12.21.11 -- IAR Selected For Next Generation Of Remotely-Operated Underwater Vehicles</title>
      <description>12/21/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/IAR-Selected-For-Next-Generation-Of-Remotely-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 21 Dec 2011 15:00:00 GMT</pubDate>
    </item>
    <item>
      <title>11.16.11 -- Creating "Smarter" Windows And Doors</title>
      <description>11/16/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Creating-Smarter-Windows-And-Doors-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 16 Nov 2011 15:00:00 GMT</pubDate>
    </item>
    <item>
      <title>10.19.11 -- 3M And IBM To Develop New Types Of Adhesives To Create 3D Semiconductors</title>
      <description>10/19/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/3M-And-IBM-To-Develop-New-Types-Of-Adhesives-0002?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 19 Oct 2011 14:00:00 GMT</pubDate>
    </item>
    <item>
      <title>09.21.11 -- IAR Systems Acquires Signum To Extend Core Technology For Advanced Processors</title>
      <description>09/21/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/IAR-Systems-Acquires-Signum-To-Extend-Core-0002?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 21 Sep 2011 14:00:00 GMT</pubDate>
    </item>
    <item>
      <title>08.17.11 -- Averting Bridge Disasters: Embedded Sensors Could Save Hundreds Of Lives</title>
      <description>08/17/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Averting-Bridge-Disasters-Embedded-Sensors-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 17 Aug 2011 14:00:00 GMT</pubDate>
    </item>
    <item>
      <title>07.20.11 -- The Future Of Chip Manufacturing</title>
      <description>07/20/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/The-Future-Of-Chip-Manufacturing-0002?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 20 Jul 2011 14:00:00 GMT</pubDate>
    </item>
    <item>
      <title>06.15.11 -- Assessing The Risks Of Wireless And Mobile Phone Radiation More Accurately  </title>
      <description>06/15/11 Embedded Technology.com Newsletter  </description>
      <link>http://www.embeddedtechnology.com/article.mvc/Assessing-The-Risks-Of-Wireless-And-Mobile-0002?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 15 Jun 2011 14:00:00 GMT</pubDate>
    </item>
    <item>
      <title>05.18.11 -- World's Smallest Atomic Clock On Sale</title>
      <description>05/18/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Worlds-Smallest-Atomic-Clock-On-Sale-0002?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 18 May 2011 14:00:00 GMT</pubDate>
    </item>
    <item>
      <title>04.20.11 -- Smart Systems Microprocessor Cores To Double To Over 12 Billion By 2015</title>
      <description>04/20/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Smart-Systems-Microprocessor-Cores-To-Double-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 20 Apr 2011 14:00:00 GMT</pubDate>
    </item>
    <item>
      <title>03.16.11 -- Emerson Network Power Introduces Service For Customization Of Embedded Motherboards</title>
      <description>03/16/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Emerson-Network-Power-Introduces-Service-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 16 Mar 2011 14:00:00 GMT</pubDate>
    </item>
    <item>
      <title>02.16.11 -- Improvements In Embedded Antennas For Broadcast Reception In Handheld Devices Unveiled</title>
      <description>02/16/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Improvements-In-Embedded-Antennas-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 16 Feb 2011 15:00:00 GMT</pubDate>
    </item>
    <item>
      <title>1.19.11 --Silicon-Germanium In Space: Project Pioneers Extreme-Environment Electronics For NASA</title>
      <description>1/19/11 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Silicon-Germanium-In-Space-Project-Pioneers-E-0003?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 19 Jan 2011 15:00:00 GMT</pubDate>
    </item>
    <item>
      <title>12.15.10 -- GSMA Launches Embedded SIM Initiative To Support The Connected Future</title>
      <description>12/15/10 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/GSMA-Launches-Embedded-SIM-Initiative-To-0002?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Wed, 15 Dec 2010 15:00:00 GMT</pubDate>
    </item>
    <item>
      <title>11.19.10 -- Producing Circuit Boards With Plastic</title>
      <description>11/19/10 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Producing-Circuit-Boards-With-Plastic-0003?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Fri, 19 Nov 2010 13:30:00 GMT</pubDate>
    </item>
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      <title>10.15.10 -- Researchers Design, Fabricate Innovative Energy Harvesting Device</title>
      <description>10/15/10 Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/Researchers-Design-Fabricate-Innovative-0002?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Fri, 15 Oct 2010 12:30:00 GMT</pubDate>
    </item>
    <item>
      <title>9.17.10 -- Silicon Oxide Circuits Break Barrier</title>
      <description>9.17.10 -- Embeded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/91710-Embedded-Techhnologycom-Newsletter-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Fri, 17 Sep 2010 12:30:00 GMT</pubDate>
    </item>
    <item>
      <title>8.20.10 -- Small Wires Make Big Connections For Microelectronics</title>
      <description>8.20.10 -- Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/82010-Embedded-Technologycom-Newsletter-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Fri, 20 Aug 2010 12:30:00 GMT</pubDate>
    </item>
    <item>
      <title>7.16.10 -- Barrier To Faster Integrated Circuits May Be Mere Speed Bump</title>
      <description>7.16.10 -- Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/71610-Embedded-Technologycom-Newsletter-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Fri, 16 Jul 2010 12:30:00 GMT</pubDate>
    </item>
    <item>
      <title>6.18.10 -- Scientists Strive To Replace Silicon With Graphene On Nanocircuitry</title>
      <description>6.18.10 -- Embedded Technology.com Newsletter</description>
      <link>http://www.embeddedtechnology.com/article.mvc/61810-Embedded-Technologycom-Newsletter-0001?atc~c=906+s=779+r=001+l=a</link>
      <pubDate>Fri, 18 Jun 2010 12:30:00 GMT</pubDate>
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